Packaging of Electronic Devices "COBP"
Leadless package without the need for mold tooling! Product launch possible with low development costs.
The "COBP (Chip On Board Package)" is a flexible leadless package suitable for product groups with small quantities and a wide variety, trial runs with reduced initial costs, and selection of package sizes tailored to requirements. After chip mounting, wire bonding is performed, followed by resin selection and sealing according to the application. Our company offers a consistent production process from wafer dicing to testing and taping. We provide support from line design to final test setup and reliability testing evaluation. 【Features】 ■ Product launch is possible with low development costs due to mold-less design. ■ High design flexibility in package layout (optimization for pin count, pitch, multi-chip, etc.). *For more details, please refer to the PDF materials or feel free to contact us.
- Company：ハマダテクノス
- Price：Other
